Nickel 205 is similar to Nickel 200, but has
compositional adjustments
to enhance its performance in electrical and electronic
applications.
Applications include:
- Anodes and grids of electronic valves
- Lead wires
- Ttransistor Housings
- Magneto-strictive Transducers
| Approximate Chemical Composition | |
| Ni | 99% min |
| Mg | 0.01 - 0.08% |
| Ti | 0.01 - 0.05% |
| DENSITY | 8.89 g/cm3 | 0.321 lb/in3 |
| MELTING POINT | 1446oC | 2635oF |
| COEFFICIENT OF EXPANSION | 13.3 µm/m °C ( 20 - 100°C) |
7.4 x 10-6 in/in
°F ( 70 - 212°F) |
| MODULUS OF RIGIDITY | 82 kN/m2 | 11893 ksi |
| MODULUS OF ELASTICITY | 207 kN/m2 | 30000 ksi |
|
ELECTRICAL RESISTIVITY |
|
| 9.5 μW • cm | 57 ohm • circ mil/ft |
|
THERMAL CONDUCTIVITY |
|
| 75 W/m • oC | 520 btu • in/ft2 • h • oF |
| CONDITION |
APPROX TENSILE STRENGTH |
APPROX SERVICE TEMPERATURE |
|||
| Annealed | 400-500 N/mm2 | 58 - 73 ksi | Tensile strength and elongation drop significantly at temperatures above 315°C (600°F). Service temperature is dependent on environment, load and size range. | ||
| Hard Drawn | 700-900 N/mm2 | 102 - 131 ksi | |||
| STANDARDS | ||
| - | ||
